crcw0201 e3 www.vishay.com vishay revision: 06-jun-12 1 document number: 20052 for technical questions, contact: thickfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 lead (pb)-free commodity thick film chip resistors features ? high volume product suitable for commercial applications ? pure tin solder contacts on ni barrier layer provides compatibility with lead (pb)-free and lead containing soldering processes ? metal glaze on high quality ceramic ? material categorization: for definitions of compliance please see www.vishay.com/doc?99912 notes ? these resistors do not feature a limited lifetime when operated within the permissible limits. however, resistance value drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifeti me. ? power rating depends on the max. temperat ure at the solder point, the component pl acement density and the substrate material. note (1) the power dissipation on the resistor generates a temperature rise against the local ambient, depe nding on the heat flow suppor t of the printed-circuit bo ard (thermal resistance). the rated di ssipation applie s only if the permitted film temperature of 155 c is n ot exceeded. standard electrical specifications model case size inch case size metric power rating p 70 w limiting element voltage u max. ac rms /dc v temperature coefficient ppm/k tolerance % resistance range ? series crcw0201 0201 rr 0603m 0.05 30 200 0.5 10.0 to 10m e96 - 200/+ 400 1.0 to 9.76 100 1 47.0 to 10m e24; e96 200 10.0 to 10m - 200/+ 400 1.0 to 9.76 200 5 10.0 to 10m e24 - 200/+ 400 1.0 to 9.76 zero-ohm-resistor: r max. = 50 m ? , i max. at 70 c = 1.0 a technical specifications parameter unit crcw0201 rated dissipation at 70 c (1) w0.05 operating voltage u max. ac rms /dc v 30 insulation voltage u ins (1 min) v 50 insulation resistance ? > 10 9 operating temperature range c - 55 to + 155 weight/1000 pieces mg 0.17
crcw0201 e3 www.vishay.com vishay revision: 06-jun-12 2 document number: 20052 for technical questions, contact: thickfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 dimensions in millimeters note ? no marking for 0201 size. part number and product description part number: crcw02011k00fned model value tolerance tcr packaging crcw0201 r = decimal k = thousand m = million 0000 = jumper d = 0.5 % f = 1.0 % j = 5.0 % z = jumper k = 100 ppm/k n = 200 ppm/k x = - 200 ppm/k/+ 400 ppm/k 0 = jumper ed ee ei product description: crcw0201 100 1k0 1 % et7 e3 crcw0201 100 562r 1 % et7 e3 model tcr resistance value tolerance value packaging lead (pb)-free crcw0201 200 ppm/k 100 ppm/k - 200/+ 400 ppm/k 1r0 = 1 ? 10r = 10 ? 1k0 = 1 k ? 10k = 10 k ? 1m0 = 1 m ? 0r0 = jumper 0.5 % 1 % 5 % et7 ef4 et2 e3 = pure tin termination finish packaging model code quantity carrier tape width pitch reel diameter crcw0201 ed = et7 10 000 paper tape acc. to iec 60068-3 type i 8 mm 2 mm 180 mm/7" ei = et2 20 000 254 mm/10" ee = ef4 50 000 330 mm/13" size dimensions solder pad dimensions inch metric l w h t1 t2 a b l 0201 0603 0.6 0.05 0.3 0.05 0.23 0.05 0.15 0.05 0.2 + 0.05 - 0.10 0.28 0.43 0.23 c r c w 0 2 0 1 1 k 0 0 f k e d
crcw0201 e3 www.vishay.com vishay revision: 06-jun-12 3 document number: 20052 for technical questions, contact: thickfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 derating test procedures and requirements en 60115-1 clause iec 60068-2 test method test procedure requirements permissible change ( ? r ) stability for product types: crcw0201 e3 1 ?? to 10 m ? 4.5 - resistance - 0.5 %; 1 %; 5 % 4.7 - voltage proof u = 1.4 x u ins ; 60 s no flashover or breakdown 4.13 58 (td) solderability solder bath method; sn60pb40 non activated flux; (235 5) c (2 0.2) s good tinning ( ? 95 % covered) no visible damage solder bath method; sn96.5ag3cu0.5 non-activated flux; (245 5) c (3 0.3) s good tinning ( ? 95 % covered) no visible damage 4.8.4.2 - temperature coefficient (20/- 55/20) c and (20/125/20) c 100 ppm/k, 200 ppm/k, - 200 ppm/k/+ 400 ppm/k 4.32 21 (uu 3 ) shear (adhesion) 9 n no visible damage 4.33 21 (uu 1 ) substrate bending depth 2 mm; 3 times no visible damage, no open circuit in bent position (0.5 % r + 0.05 ? ) 4.19 14 (na) rapid change of temperature 30 min. at - 55 c; 30 min. at 125 c 5 cycles (0.5 % r + 0.05 ? ) 1000 cycles (1 % r + 0.05 ? ) - 50 0 50 100 150 0 ambient temperature amb in c fraction of rated dissipation p 70 in % 50 100 70 ?
crcw0201 e3 www.vishay.com vishay revision: 06-jun-12 4 document number: 20052 for technical questions, contact: thickfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 all tests are carried out in accordance with the following specifications: ? en 60115-1, generic specification ? en 140400, sectional specification ? en 140401-802, detail specification ? iec 60068-2-x, environmental test procedures packaging of components is done in paper tapes according to iec 60286-3. 4.23 - climatic sequence: - (2 % r + 0.1 ? ) 4.23.2 2 (ba) dry heat 125 c; 16 h 4.23.3 30 (db) damp heat, cyclic 55 c; ? 90 % rh; 24 h; 1 cycle 4.23.4 1 (aa) cold - 55 c; 2 h 4.23.5 13 (m) low air pressu re 1 kpa; (25 10) c; 1 h 4.23.6 30 (db) damp heat, cyclic 55 c; ? 90 % rh; 24 h; 5 cycles 4.23.7 - dc load u = ? u max. 4.25.1 - endurance at 70 c u = ? u max.; 1.5 h on; 0.5 h off; 70 c; 1000 h (2 % r + 0.1 ? ) 70 c; 8000 h (4 % r + 0.1 ? ) 4.18.2 58 (td) resistance to soldering heat solder bath method (260 5) c; (10 1) s (1 % r + 0.05 ? ) 4.35 - flamability, needle flame test iec 60695-11-5; 10 s no burning after 30 s 4.24 78 (cab) damp heat, steady state (40 2) c; (93 3) % rh; 56 days (2 % r + 0.1 ? ) 4.25.3 - endurance at upper category temperature 155 c, 1000 h (2 % r + 0.1 ? ) 4.29 45 (xa) component solvent resistance isopropyl alcohol; 50 c; method 2 no visible damage 4.22 6 (fc) vibration, endurance by sweeping f = 10 hz to 2000 hz; x, y, z ? 1.5 mm; a ? 200 m/s 2 ; 10 sweeps per axis (0.5 % r + 0.05 ? ) test procedures and requirements en 60115-1 clause iec 60068-2 test method test procedure requirements permissible change ( ? r ) stability for product types: crcw0201 e3 1 ?? to 10 m ? p 70 x r p 70 x r
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